Engineering Expertise Across the Semiconductor Product Lifecycle

Development of semiconductor test programs for characterization, validation, and production testing. Proficiency in testing digital, RF, power management, automotive, analog, high-speed I/O devices and AI chips on the Advantest V93k platform. End-to-end engineering support from R&D to product maturity.

Wafer probing at -55°C to 150°C for up to 12″ wafers with direct-dock probing capability. Final test at -55°C to 175°C with active thermal control, octal-site testing, and 100mm × 100mm package testing. Extended range to -80°C to 250°C with TFU. Handlers from Hontech, Chroma, and Synax.

State-of-the-art reliability labs with Sonoma and Tahoe HTOL chambers (5W to 1000W water-cooled). HAST (biased/unbiased) and autoclaves from Hirayama. Temperature cycling, humidity, bake, and PCB environmental stress testing to JEDEC and MIL-STD standards. ESD testing and proprietary latch-up test methodology.

Design of 4, 8, 16, and up to 64-site load boards up to 42 layers for V93k, Chroma, and Teradyne platforms using Allegro Orcad. Probe cards up to 128 sites with impedance-controlled high signal count design. Signal and power integrity simulations using Ansys HFSS/Siwave including S-parameter extraction and TDR analysis.

Access to V93k Exascale testers with 2048 channels at 5Gbps and Wavescale RF systems for up to 18 GHz. High pin count, high-speed, and high-power V93k Smartscale testers. Up to octal-site tri-temp ATC handlers. Available in-house or via remote access from iTest San Jose and iTest Petah Tikva.

Comprehensive failure analysis capabilities: PCB first article inspection, cross sectioning, optical microscopy with image analysis, scanning electron microscope with EDS, X-ray imaging, C-SAM, die shear and solder dip testing, wire bond pull testing, hermeticity testing, die and pry testing, PCB auditing, and IC plastic package decapsulation.